کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
11008869 | 1840429 | 2019 | 18 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
Nanocrystalline and amorphous nickel-tungsten alloy with relatively high tungsten contents of up to 34 at.% were produced by electrodeposition. The Hall-Petch relationship and breakdown was studied in this alloy, with grain sizes ranging from 25â¯nm to fully amorphous. In this higher tungsten content alloy, evidence of solid-solution strengthening was found, which was previously absent in alloys with <13 at.% tungsten. A Hall-Petch trend with a critical grain size of 5â¯nm was observed, in line with expectations.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Surface and Coatings Technology - Volume 357, 15 January 2019, Pages 23-27
Journal: Surface and Coatings Technology - Volume 357, 15 January 2019, Pages 23-27
نویسندگان
Chun Yee Aaron Ong, Daniel John Blackwood, Yi Li,