New defect detection approach using near electromagnetic field probing of high density PCBAs

We will present the possibility of using electromagnetic signature to diagnose faulty components contactlessly. The technique consists in using magnetic field probes, which detect the field distribution over powered sensitive components. Reference EM signatures are extracted from a fault-free circuit, which will be compared to those extracted from a sample PCBA in which we introduced a component level defect by removing or changing the value of critical components to evaluate the relevance of the method.