Microstructural, electrochemical and tribo-electrochemical characterisation of titanium-copper biomedical alloys

• Tribo-electrochemical behavior of new titanium-copper (Ti-xCu) alloys.
• Powder metallurgy for biomedical applications.
• Ti2Cu intermetallics in the Ti-xCu alloys increase with the copper content and change their electrochemical and tribocorrosion behaviour.
• Copper effect in the tribocorrosion behaviour of the Ti-xCu alloys is mechanically activated.

Microstructure, electrochemical and wear behaviour of different Titanium-copper biomedical alloys (Ti-xCu, x = 3, 7.1 and 12%wt) obtained by powder metallurgy for dental implant applications have been analysed in artificial saliva and compared to Ti cp. Copper in the alloy increases the amount of eutectoid in the grain boundary, favours the formation of Ti2Cu intermetallics and increases the hardness of the alloys. It enhances the cathodic reaction while slightly increasing the anodic reaction rate. Total material loss due to the wear and corrosion decreases with the increase in the Ti2Cu intermetallics, which also reduces wear volume.