کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1498736 1510930 2013 4 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging
چکیده انگلیسی

This paper describes a method to achieve rapid pressureless low-temperature sintering of Ag nanoparticles for bonding. Organic shells adsorbing on the surface of Ag nanoparticles to stabilize them were thinned to create a sparse protecting layer. The numerous coherent twin boundaries formed in sintered Ag nanoparticles with a grain size of 21 nm induce ultrahigh thermal conductivity (229 W m−1 K−1), which overcomes the intrinsic defect that metals with nanosized grains generally exhibit a significantly reduced thermal conductivity because of the grain boundary scattering effect.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Scripta Materialia - Volume 69, Issues 11–12, December 2013, Pages 789–792
نویسندگان
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