کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1499305 | 993301 | 2012 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Thermomigration of Ti in flip-chip solder joints
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
Titanium has a very large heat of transport value of −768 kJ mol–1. However, thermomigration of Ti in solder joints has not been examined. In this study, void formation was observed in non-current-stressed Al traces during electromigration and thermomigration tests of SnAg solder joints. Voids formed inside the traces located above the solder bumps with no current flow. We found that Ti thermomigration occurred in the joint, resulting in the reaction of Al and Cu, leaving voids behind in the Al trace.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Scripta Materialia - Volume 66, Issue 9, May 2012, Pages 694–697
Journal: Scripta Materialia - Volume 66, Issue 9, May 2012, Pages 694–697
نویسندگان
Hsiao-Yun Chen, Han-Wen Lin, Chien-Min Liu, Yuan-Wei Chang, Annie T. Huang, Chih Chen,