کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1501149 | 993372 | 2008 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Microstructural comparison of material damage in GaAs caused by Berkovich and wedge nanoindentation and nanoscratching
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Microstructural comparison of material damage in GaAs caused by Berkovich and wedge nanoindentation and nanoscratching Microstructural comparison of material damage in GaAs caused by Berkovich and wedge nanoindentation and nanoscratching](/preview/png/1501149.png)
چکیده انگلیسی
Nanoindentations and nanoscratches in GaAs under Berkovich and 60° wedge indenters were investigated via transmission electron microscopy. Dislocations, twins and slip bands are convergent under the Berkovich indenter, whereas they are only divergent under the 60° wedge. This difference is explained in terms of crystallography and geometry. Median cracks were created under the wedge indenter although only diverging bands are observed. Finally, twinning was found to be the main deformation process occurring during indentation, whereas only slip bands and perfect dislocations are observed during scratching.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Scripta Materialia - Volume 59, Issue 3, August 2008, Pages 364–367
Journal: Scripta Materialia - Volume 59, Issue 3, August 2008, Pages 364–367
نویسندگان
M. Parlinska-Wojtan, K. Wasmer, J. Tharian, J. Michler,