کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1502503 | 993424 | 2006 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
A rheological assessment of the effect of trace level Ni additions on the solidification of Sn–0.7Cu
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: A rheological assessment of the effect of trace level Ni additions on the solidification of Sn–0.7Cu A rheological assessment of the effect of trace level Ni additions on the solidification of Sn–0.7Cu](/preview/png/1502503.png)
چکیده انگلیسی
The influence of trace level Ni additions on the eutectic solidification mode of Sn–0.7Cu has been studied using continuous torque experiments during solidification. The solid fraction at which resistance to paddle rotation at the thermal centre of the sample occurs is related to the spatial distribution of solid during solidification. The results indicate that a transition in solidification mode occurs in the range 0–300 ppm Ni. Growth occurs antiparallel to heat flow from near the mould walls in the Ni-free alloy, while equiaxed growth from distributed centres dominates in alloys containing at least 300 ppm Ni.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Scripta Materialia - Volume 54, Issue 9, May 2006, Pages 1557–1562
Journal: Scripta Materialia - Volume 54, Issue 9, May 2006, Pages 1557–1562
نویسندگان
C.M. Gourlay, K. Nogita, S.D. McDonald, T. Nishimura, K. Sweatman, A.K. Dahle,