کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1537191 | 996581 | 2010 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Measuring thickness change of transparent plate by electronic speckle pattern interferometry and digital image correlation
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
مواد الکترونیکی، نوری و مغناطیسی
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چکیده انگلیسی
The thickness change of transparent plates was measured by electronic speckle pattern interferometry (ESPI) method and digital image correlation (DIC) method. An out-of-plane ESPI system was developed based on the Michelson interferometer, and a new thickness measurement method was designed, which is on the basis of Snell's law of refraction and DIC. The main principles and experimental procedures of these two methods were presented. The thickness change of polymethyl specimens under uniaxial tensile loading were measured by the optical techniques and compared with each other. The results reveal that the data obtained with DIC method achieve better linearity than ESPI.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Optics Communications - Volume 283, Issue 18, 15 September 2010, Pages 3481–3486
Journal: Optics Communications - Volume 283, Issue 18, 15 September 2010, Pages 3481–3486
نویسندگان
Xiangjun Dai, Hai Yun, Qi Pu,