Multiscale modeling of residual stresses in isotropic conductive adhesives with nano-particles

► Computational homogenization analysis of conductive adhesive interconnect. ► Effects of varying particle fraction and distribution on residual stresses. ► High particle fraction decreases overall stress but increases fine scale stress. ► Percolated particle arrangement leads to high fine scale stress concentrations. ► Multiscale approach is crucial for the analysis of this problem.