Numerical modeling and simulation of a diffusion-controlled liquid-solid phase change in polycrystalline solids

► A new 2-D numerical simulation model was developed to study kinetics of TLP bonding process. ► The model outputs were found to be in good conformity with experimental results. ► Diffusivity along intergranular regions did not significantly reduce processing time. ► Increased processing time in single crystal superalloy was not due to absence of grain boundaries.