کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1562627 999592 2010 9 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Atomic-level stress calculation and surface roughness of film deposition process using molecular dynamics simulation
موضوعات مرتبط
مهندسی و علوم پایه سایر رشته های مهندسی مکانیک محاسباتی
پیش نمایش صفحه اول مقاله
Atomic-level stress calculation and surface roughness of film deposition process using molecular dynamics simulation
چکیده انگلیسی

Molecular dynamics (MD) are used to investigate the surface roughness of grown films and to calculate the atomic-level stress for different deposition parameters of incident energy, substrate temperature, incident angle, and deposition rate. The second-moment approximation of the tight-binding (TB-SMA) many-body potential is employed to model the interaction. The results reveal that the effect of the incident angle on the surface roughness is very small. However, the surface roughness can be improved by increasing the incident energy and substrate temperature. Increasing the incident energy has minor effects on the average mean biaxial stress and the average normal stress, while the increasing of the substrate temperature could reduce the oscillations of both average stresses.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Computational Materials Science - Volume 48, Issue 3, May 2010, Pages 520–528
نویسندگان
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