کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1575229 | 1514741 | 2014 | 12 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Enhancing the high temperature plasticity of a Cu-containing austenitic stainless steel through grain boundary strengthening
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
دانش مواد (عمومی)
پیش نمایش صفحه اول مقاله

چکیده انگلیسی
The addition of 3 wt% Cu to heat-resistant SUS 304H austenitic steel enhances its high temperature mechanical properties. To further improve the properties, particularly the creep resistance and ductility at high temperatures, a post-solutionizing heat-treatment method that involves an intermediated annealing either at 700 or 800 °C after solutionizing for durations up to 180 min was employed. The purpose this heat-treatment is to precipitate planar Cr23C6 at the grain boundaries, which results in the boundaries getting serrated. Detailed microstructural analyses of these 'grain boundary engineered' alloys was conducted and their mechanical performance, both at room temperature and at 750 °C, was evaluated. While the grain size and texture are unaffected due to the high temperature hold, the volume fraction of Ʃ3 twin boundaries was found to increase significantly. While the strength enhancement was only marginal, the ductility was found to increase significantly, especially at high temperature. A marked increase in the creep resistance was also noted, which is attributed to the reduction of the grain boundary sliding by the grain boundary serrations and the suppression of grain boundary cavitation through the optimization of the volume fraction and spacing of the Cr23C6 precipitates. The special heat-treatment performed with holding time of 3 h at 700 °C resulted in the optimum combination of strength, ductility and creep resistance at high temperature.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: A - Volume 602, 25 April 2014, Pages 77-88
Journal: Materials Science and Engineering: A - Volume 602, 25 April 2014, Pages 77-88
نویسندگان
Gaurav Singh, Sung-Min Hong, Keiichiro Oh-ishi, Kazuhiro Hono, Eric Fleury, Upadrasta Ramamurty,