کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1579617 1001228 2010 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Microstructure and tensile behavior of Cu–Al multi-layered composites prepared by plasma activated sintering
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد دانش مواد (عمومی)
پیش نمایش صفحه اول مقاله
Microstructure and tensile behavior of Cu–Al multi-layered composites prepared by plasma activated sintering
چکیده انگلیسی

Multi-layered Cu/Al composites were fabricated with Cu and Al foils by using plasma activated sintering (PAS) process. Microstructure analysis revealed that the interfacial zone between the Cu and Al consisted of Al4Cu9, AlCu and Al2Cu individual layers, where the Al4Cu9 layer was dominant. In situ observation during the failure process of the Cu/Al multi-layered composite under tensile loading indicated that the failure was initiated by crack generation in the intermetallic layers. With increasing load, these cracks propagated into the Al layers along the Al grain boundaries, but got blunt at the intermetallic/Cu interface instead of penetrating into the Cu layers. Cracking of the intermetallic and Al layers in turn led to local plastic deformation of the copper layers. The localized deformation, which was confined to the small regions between the opposite cracks in the neighbouring intermetallic layers, was prolonged till the composite failure.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: A - Volume 527, Issue 20, 25 July 2010, Pages 5234–5240
نویسندگان
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