Phase segregation, interfacial intermetallic growth and electromigration-induced failure in Cu/In-48Sn/Cu solder interconnects under current stressing

Phase segregation, interfacial intermetallic growth and electromigration-induced failure in Cu/In-48Sn/Cu solder interconnects under current stressing

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 673, 15 July 2016, Pages 372-382

Yi Li, Adeline B.Y. Lim, Kaiming Luo, Zhong Chen, Fengshun Wu, Y.C. Chan,