The effect of doping on thermoelectric performance of p-type SnSe: Promising thermoelectric material

• Tin selenide (SnSe) doped with non-toxic and inexpensive dopants.
• Synthesized highly dense SnSe employing Spark plasma sintering.
• Enhanced thermoelectric compatibility factor of SnSe.
• Enhanced thermoelectric performance of SnSe doped with Copper.

Tin selenide (SnSe) based thermoelectric materials are being explored for making inexpensive and efficient thermoelectric devices with improved thermoelectric efficiency. As both Sn and Se are earth abundant and relatively inexpensive and these alloys do not involve toxic materials, such as lead and expensive tellurium. Hence, in the present study, we have synthesized SnSe doped with 2 at% of aluminium (Al), lead (Pb), indium (In) and copper (Cu) individually, which is not reported in literature. Out of these, Cu doped SnSe resulted in enhancement of figure-of-merit (zT) of ∼0.7 ± 0.02 at 773 K, synthesized employing conventional fusion method followed by spark plasma sintering. This enhancement in zT is ∼16% over the existing state-of-the-art value for p-type SnSe alloy doped with expensive Ag. This enhancement in ZT is primarily due to the presence of Cu2Se second phase associated with intrinsic nanostructure formation of SnSe. This enhancement has been corroborated with the microstructural characterization using field emission scanning electron microscopy and X-ray diffraction studies. Also, Cu doped SnSe exhibited a higher value of carrier concentration in comparison to other samples doped with Al, Pb and In. Further, the compatibility factor of Cu doped SnSe alloys exhibited value of 1.62 V−1 at 773 K and it is suitable to segment with most of the novel TE materials for obtaining the higher thermoelectric efficiencies.