کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1607340 | 1516236 | 2016 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فلزات و آلیاژها
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders](/preview/png/1607340.png)
چکیده انگلیسی
As an ideal modifier, the cage-type polyhedral oligomeric silsesquioxane (POSS)-silanol creates a strong bonding with the solder without agglomeration. It has been shown that the addition of POSS-silanol improves both the mechanical performance and the solder's resistance to electromigration. This study further examined the effect of the addition of POSS-silanol on whisker growth in a Sn3.0Ag0.5Cu (SAC305) solder. The whisker growth was studied for pure SAC305 and SAC305 modified with POSS-silanol under isothermal aging and thermal cycling conditions. The results indicate that the added POSS-silanol not only reinforces the solder joint, but also inhibits whisker formation under both thermal aging and thermal cycling conditions. POSS-silanol can therefore be considered a promising modifier material which enhances the reliability of solders. During the thermal aging process, the added POSS-silanol was found to inhibit the interdiffusion of Sn and Cu atoms at the interface region, thereby preventing the formation of Cu6Sn5 but promoting the conversion of Cu6Sn5 into Cu3Sn. During the thermal cycling process, the added POSS-silanol significantly inhibited whisker formation and the deformation of the interface by stiffening the solder matrix and decreasing the driving force for whisker formation.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 657, 5 February 2016, Pages 400-407
Journal: Journal of Alloys and Compounds - Volume 657, 5 February 2016, Pages 400-407
نویسندگان
Limin Ma, Yong Zuo, Sihan Liu, Fu Guo, Andre Lee, K.N. Subramanian,