کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1608412 1516248 2015 11 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi-Ag composite solders
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فلزات و آلیاژها
پیش نمایش صفحه اول مقاله
Effect of silver (Ag) nanoparticle size on the microstructure and mechanical properties of Sn58Bi-Ag composite solders
چکیده انگلیسی
The effect of Ag nanoparticle size on the microstructure of solder matrix, microhardness, growth of solder/Cu interfacial intermetallic compounds (IMC) and shear strength were investigated. Ag nanoparticles with sizes of 31 nm, 76 nm and 133 nm were added to Sn58Bi to prepare composite solders. The experimental results showed that Ag played a positive role in improving the microstructure and mechanical properties of Sn58Bi solder and the extent of the improvement differed with the size of the doped Ag particles. The best improvement resulted from the addition of 76 nm Ag particles: the microstructure refined by 49.1% and the microhardness was enhanced by 12.2% for the as-prepared solders; the Cu-Sn IMC growth exponent reduced from 0.394 to 0.339, the IMC thickness reduced by 39.7% and the shear strength reinforced by 18.9% after liquid reaction at 220 °C for 180 min. However, the improvements resulted from the addition of larger (133 nm) or smaller (31 nm) Ag particles were not as obvious. Based on the theories related to material performance reinforcement (such as refinement strengthening, dispersion strengthening and adsorption theory) and the agglomeration behavior of the nanoparticles, the mechanism of particle size effect on nano-composite solder properties was analyzed and an optimal particle size is proposed.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 645, 5 October 2015, Pages 566-576
نویسندگان
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