EBSD study of a hot deformed nickel-based superalloy

Hot deformation behaviors of a typical nickel-based superalloy are investigated by isothermal compression tests under the deformation temperature range of 920-1040 °C and strain rate range of 0.001-1 s−1. Scanning electron microscopy (SEM), electron backscattered diffraction (EBSD) technique and transmission electron microscopy (TEM) are employed to study the evolution of hot deformed microstructures. It is found that the fraction of low angle grain boundaries decreases with the increase of deformation temperature or the decrease of strain rate. This is related to the decrease of dynamic recrystallization degree under the low deformation temperature or high strain rate. The fraction of low angle grain boundaries shows a rapid increase at the relatively small deformation degree, and then a significant decrease due to the progress of dynamic recrystallization (DRX). The microstructural changes indicate that both continuous dynamic recrystallization (CDRX) and discontinuous dynamic recrystallization (DDRX) take place during hot deformation. However, the small fraction of low angle boundaries with 10-15° misorientation indicates that the CDRX plays a minor role on the nucleation of dynamic recrystallization. Discontinuous dynamic recrystallization (DDRX) characterized by grain boundary bulging is the dominant nucleation mechanism for the studied superalloy.