کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1610010 | 1516266 | 2015 | 6 صفحه PDF | دانلود رایگان |
• Excessive serrated cathode dissolution strongly depends on the Sn grain orientation.
• Sn grain orientation is a dominant factor that controls the direction of the serrated teeth.
• Producing joints with fine Sn grains is one of the approaches to improve the reliability against current-induced failures in solder joints.
Excessive metal dissolution is one of the major electromigration-induced degradation mechanisms in interconnects, and it often produces a distinctive serrated cathode interface with most of the serrated teeth inclined toward a specific direction. In this study, actual flip-chip solder joints were systematically analyzed to understand this highly interesting morphology. It was unequivocally established that the Sn grain orientation is a dominant factor that controls the direction of the serrated teeth. When the c-axis of a Sn grain was nearly parallel to the electron flow direction, serrated dissolution occurred, with the serrated teeth inclined toward the c-axis. These observations were rationalized based on the diffusion anisotropy of Cu in Sn.
Journal: Journal of Alloys and Compounds - Volume 627, 5 April 2015, Pages 281–286