Pulse-reverse electrodeposition of Cu–SiC nanocomposite coating: Effect of concentration of SiC in the electrolyte

• Codeposition of reinforcement is dependent on the nature of surfactant.
• Cationic surfactant is the most efficient surfactant for codeposition.
• Hardness does not follow strictly to the incorporated reinforcement.
• Higher particle content in the electrolyte leads to higher internal stress.
• In presence of surfactants, a bath containing 5 g/L SiC gives best results.

Cu–SiC nanocomposite coatings have been electrodeposited from an aqueous sulfate electrolyte using pulse reverse current. The effect of different concentrations of nano SiC particles in the electrolyte on codeposition and hence on the properties of the composites have been studied both in absence and in the presence of three different types of surfactant (anionic, cationic and nonionic). The amount of incorporated reinforcement in the composite has been observed to be dependent on the presence and the nature of the surfactants. Cationic surfactant has been observed to be the most capable surfactant in incorporating SiC particles into the copper matrix. Composites prepared under highest concentration of SiC particle in the electrolyte have been observed to be under highest tensile stress. The hardness has been observed to be dependent on the combined effect of incorporated reinforcement, structure and crystallite size of the composites. In the presence of surfactants, most attractive hardness values have been observed in the composites prepared from a solution containing 5 g/L nano SiC particles.