Characterization of low speed shear test reliability of Sn-1.0Ag-XCe/ENEPIG solder joint

► Pd element in ENEPIG surface finishes retarded IMC. ► Ce element retarded Sn diffuse from solder matrix to the interface. ► Greater shear forces were measured with higher shear speed. ► More ductile fracture area was found with Ce content solder. ► Increasing in Pd thickness or Ce concentration did not affect to shear strength.