Electromigration of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-0.2Zn solder joints with Au/Ni(P)/Cu and Ag/Cu pads

It has previously been established that adding 0.2 wt.% Zn into a Sn-3Ag-0.5Cu-0.5Ce alloy improves the mechanical properties and eliminates the problem of rapid whisker growth. However, no detailed studies have been conducted on electromigration behavior of Sn-3Ag-0.5Cu-0.5Ce-0.2Zn alloy. The electromigration damage in solder joints of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-0.2Zn with Ag/Cu pads and Au/Ni(P)/Cu pads was studied after current stressing at room temperature with an average current density of 3.1 × 104 A/cm2. With additions of 0.5 wt.% Ce and 0.2 wt.% Zn, the electromigration processes of Sn-Ag-Cu solder joints were accelerated due to refinement of the solder matrix when joint temperature was around 80 °C. Since Ni is more resistant than Cu to diffusion driven by electron flow, solder joints of both alloys (Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-0.2Zn) with Au/Ni(P)/Cu pads possess longer current-stressing lifetimes than those with Ag/Cu pads.