کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
1623375 1516415 2008 8 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Oxidation behavior of Sn–Zn solders under high-temperature and high-humidity conditions
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فلزات و آلیاژها
پیش نمایش صفحه اول مقاله
Oxidation behavior of Sn–Zn solders under high-temperature and high-humidity conditions
چکیده انگلیسی

The oxidation behavior of Sn–9Zn and Sn–8Zn–xBi (x = 1, 3, 6) solders under high-temperature and high-humidity conditions has been investigated as a function of exposure time. The evolution of surface and cross-sectional microstructures during exposure has been examined, and an oxidation model for the Sn–Zn alloys was proposed. The poor oxidation resistance of Sn–Zn alloys is attributed to the oxidation of element Zn, which diffuses to the grain boundaries of Sn matrix, forming ZnO along those boundaries. It was also found that Bi forms a solid solution in Sn with a solubility limit of 4.4 wt.%, which causes the Sn matrix to become liable to form cracks, as well as to have a high distortion energy. The solid solution of Sn(Bi) is considered to be one of the reasons for the rapid oxidation of Bi added alloys.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 462, Issues 1–2, 25 August 2008, Pages 244–251
نویسندگان
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