کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1626474 | 1516437 | 2007 | 5 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Solder electromigration in Cu/In/Cu flip chip joint system
دانلود مقاله + سفارش ترجمه
دانلود مقاله ISI انگلیسی
رایگان برای ایرانیان
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فلزات و آلیاژها
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Solder electromigration in Cu/In/Cu flip chip joint system Solder electromigration in Cu/In/Cu flip chip joint system](/preview/png/1626474.png)
چکیده انگلیسی
Electromigration in Cu/In/Cu flip chip joint system has been studied at 398 K with a current of 20 kA/cm2. The void nucleation and growth process was investigated with the experiment and the 3D simulation. In was transported towards the anode and a void nucleated at the highest current density point near the cathode. The void nucleated at the In/Cu11In9 interface and grew along the cathode side. The unique solder bump deformation towards the cathode occurred in the early stage of the electromigration test. The temperature of the solder joint during the electromigration test was measured successfully both by a thermo-couple and by the resistance change of the junction line between two flip chip joints.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 437, Issues 1–2, 28 June 2007, Pages 186–190
Journal: Journal of Alloys and Compounds - Volume 437, Issues 1–2, 28 June 2007, Pages 186–190
نویسندگان
Kimihiro Yamanaka, Yutaka Tsukada, Katsuaki Suganuma,