کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1641785 | 1517225 | 2016 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
TEM observation of interfacial compounds of SnAgCu/ENIG solder bump after laser soldering and subsequent hot air reflows
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
In three-dimensional (3D) packaging and assembly technology, Lead-free SnAgCu solder joints inevitably experience multiple reflows. The interfacial compounds of Sn3.0Ag0.5Cu (SAC305)/ Electroless Ni-P/Immersion Au (ENIG) solder bump after laser soldering and subsequent hot air reflows were observed by transmission electron microscopy (TEM), respectively. The initial laser soldering played a key role in interfacial compound evolution during the subsequent multiple reflows. After laser soldering, a thin P-rich layer and an ultrafine scallop-type (Ni, Cu)3Sn4 layer formed at the interface of SAC305/ENIG. The valleys of ultrafine (Ni, Cu)3Sn4 grains served as rapid channels for Ni diffusion, which contributed to the formation of dendritic η-(Cu, Ni)6Sn5+(Ni, Cu)3Sn2 intermetallic compounds after the first hot air reflow. However, with the number of reflow times increasing, the η-(Cu, Ni)6Sn5 totally transformed to noodle-like (Ni, Cu)3Sn2 owing to their similarly hexagonal lattice structure and the limited Cu supply in solder.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Letters - Volume 163, 15 January 2016, Pages 254-257
Journal: Materials Letters - Volume 163, 15 January 2016, Pages 254-257
نویسندگان
Baolei Liu, Yanhong Tian, Wei Liu, Weiwei Wu, Chunqing Wang,