کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
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1648574 | 1007560 | 2011 | 4 صفحه PDF | دانلود رایگان |
Bridgman-type directional solidification experiments have been carried out in Cu–20Sn peritectic alloy. Peritectic coupled growth and banding structures have been observed at low growth rates (1.5 and 2 μm/s) under a temperature gradient up to 40 K/mm. The peritectic coupled growth structure, containing rod dendrite primary α phase plus peritectic β phase, forms initially. As solidification proceeds, peritectic coupled growth is overgrown by banding or island banding structures. The formation of banding structure from coupled growth is explained by a model involving Sn concentration change at nucleation of the secondary phase ahead of the solid/liquid interface. It is found that the competitive growth between the α and β phases also plays a critical role on the formation of banding structures.
Journal: Materials Letters - Volume 65, Issue 11, 15 June 2011, Pages 1628–1631