کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1649162 | 1007575 | 2010 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Self-arrangement of solder balls by using the surface wettability difference
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
This letter describes a simple and efficient method of the solder ball placement for electronic packaging. For self-arranging solder balls by using the surface wettability difference, the substrate surface was patterned into the hydrophilic Au solder ball land array with the hydrophobic Teflon passivation layer. Water droplets were formed only on the solder ball lands after dipping the patterned substrate into water. Then, the solder balls were placed on each of the wetted solder ball lands. After soldering two plates with 3Â ÃÂ 3, 4Â ÃÂ 4, and 5Â ÃÂ 5 arrayed solder balls, their average shear strengths were as high as 195, 220, and 251Â MPa, respectively.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Letters - Volume 64, Issue 11, 15 June 2010, Pages 1283-1286
Journal: Materials Letters - Volume 64, Issue 11, 15 June 2010, Pages 1283-1286
نویسندگان
Jong-hyeon Chang, Jangwon Hong, James Jungho Pak,