کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1649349 | 1007579 | 2009 | 4 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Epitaxial growth of Cu6Sn5 formed at Sn-based lead-free solder/non-textured polycrystalline Cu plate interface
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
This study examines the epitaxial growth of the intermetallic compound (IMC) of Cu6Sn5 (or (Cu,Ni)6Sn5) that forms at the interface between molten Sn-based lead-free solders and non-textured polycrystalline Cu substrates. Sn, Sn–Cu, Sn–Cu–Ni and Sn–Ag–Cu solders were investigated. The dominant growing planes in a hexagonal structure of this IMC on Cu substrates are (101) and (102). Addition of trace Ni into Sn–Cu solders leads to an increase in (101) growth and a decrease in (102) growth. The presence of Ag in Sn–Ag–Cu solders facilitates (102) growth and suppresses (101) growth. Such an epitaxial growth should have a large influence on the mechanical and electrical characteristics of the Sn-based solder/Cu joints.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Letters - Volume 63, Issue 30, 31 December 2009, Pages 2687–2690
Journal: Materials Letters - Volume 63, Issue 30, 31 December 2009, Pages 2687–2690
نویسندگان
Hideaki Tsukamoto, Tetsuro Nishimura, Kazuhiro Nogita,