Synthesis of smooth copper deposits by simultaneous electroforming and polishing process

Copper deposits with smooth surface were prepared on a cylindrical cathode by a simultaneous electroforming and polishing process. In a specifically developed equipment, the cathode was embedded in insulating ceramic beads, and the beads were forced to polish the deposit surface during electrodepositing. The prepared deposits were characterized by scanning electron microscope (SEM) and transmission electron microscope (TEM). It was found that simultaneous polishing in electrodeposition could evidently affect the microstructure of the deposits and smooth their surfaces. In contrast with the deposits electrodeposited by traditional method, the ones produced by the new process present higher microhardness and better corrosion resistance in neutral aqueous NaCl solution. Their structure and properties depend on the strength of the polishing effect, which can be enhanced by increasing the cathode rotational speed.