Wear of diamond grinding wheels and material removal rate of silicon nitrides under different machining conditions

Studies have been carried out to determine the influence of depths of cut of diamond grinding wheels on the wear of diamond abrasives and the material removal rate of silicon nitride during single pass grinding. The results suggest that there is an optimum depth of cut, which yields the greatest material removal rate. If the grinding depth is less than this optimum depth of cut, the grinding efficiency is low. If the grinding depth is larger than this optimum depth of cut, premature dulling of the diamond wheel occurs. Furthermore, some of the diamond abrasives break due to grain fracture, and the original sharp diamond abrasives become flat and smooth. As a result, the material removal rate of silicon nitride drastically decreases.