کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1657362 | 1008282 | 2014 | 5 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Electromigration in thin-film solder joints
ترجمه فارسی عنوان
الکتروگرافی در اتصالات لحیم کاری نازک
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
چکیده انگلیسی
Intermetallic compound (IMC) formation and growth are critical reliability issues with interconnected microelectronics, especially for small-scale solder joints in three-dimensional integrated circuits (3D IC) packaging. In this study, the growth behavior of IMCs in ultrathin 3D-IC solder joints under electromigration was investigated using a field-emission scanning electron microscope (FE-SEM) equipped with an electron backscatter diffraction (EBSD) analysis system. The joints consisted of a Cu/Sn/Cu configuration with a Sn thickness of ~ 30 μm. We determined a strong dependence of the IMC growth and Cu pad depletion on the β-Sn orientation upon electron current stressing. When the c-axis of the Sn grain was oriented in the direction of the electron flow, aggressive CuSn IMC growth and Cu pad depletion occurred at the anode and cathode, respectively. A mathematical analysis based on crystallography and electromigration theory was used to rationalize the strong dependences that were observed.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Surface and Coatings Technology - Volume 259, Part B, 25 November 2014, Pages 257-261
Journal: Surface and Coatings Technology - Volume 259, Part B, 25 November 2014, Pages 257-261
نویسندگان
C.E. Ho, C.H. Yang, L.H. Hsu,