کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1659214 | 1008371 | 2010 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
High rate of copper electrodeposition from the hexafluorosilicate bath
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
A high-rate copper electrodeposition performed from a hexafluorosilicate bath is presented in this article. It is shown that the current density for electrodeposition ranges from 1 to 30 A dmâ 2 and the optimal suggested current density is 15 A dmâ 2 or a rate of 200 μm h- 1. High plating rate is due to a higher mass transport through the hexafluorosilicate media when compared to a conventional sulphate-based bath. The microstructure, texture and mean grain size of the 30 μm-thick films plated from the additive free bath and the bath containing 10â 3 mol dmâ 3 thiourea and 500 ppm Clâ is studied with respect to the applied current density. Copper plated from the bath without additives has a macrocrystalline structure with preferable 110 texture and mean grain size of 65-85 nm, while thiourea produces a microsmooth surface and 111 texture with grain size of 40-70 nm.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Surface and Coatings Technology - Volume 204, Issue 20, 15 July 2010, Pages 3141-3146
Journal: Surface and Coatings Technology - Volume 204, Issue 20, 15 July 2010, Pages 3141-3146
نویسندگان
Petr V. Dudin, Olga V. Reva, Tatyana N. Vorobyova,