کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
1662787 | 1517705 | 2006 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Copper metallization of polymers by a palladium-free electroless process
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
Different polymer substrates were copper-plated by electroless deposition without using the Pd-based conventional catalyst to initiate the redox reaction. The principle of the process is based on the deposition of a copper(II) organic precursor film on the polymer surface to be metallized and on the reduction of the Cu(+ 2) ions. This reduction is obtained by different chemical, thermal, photonic or plasma techniques and its results were studied by XPS analysis. A polymer surface densely and homogeneously seeded with Cu(0) species allows to initiate the autocatalytic deposition of copper films. Their thickness was measured by X-ray fluorescence spectrometry and their adhesion evaluated by the Scotch® tape test.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Surface and Coatings Technology - Volume 200, Issues 18–19, 8 May 2006, Pages 5478–5486
Journal: Surface and Coatings Technology - Volume 200, Issues 18–19, 8 May 2006, Pages 5478–5486
نویسندگان
M. Charbonnier, M. Romand, Y. Goepfert, D. Léonard, M. Bouadi,