Copper film deposition rates by a hot refractory anode vacuum arc and magnetically filtered vacuum arc

The HRAVA deposition rate initially increased with time and saturated at a maximum of ∼ 2.3 μm/min after 1 min. The plasma expanded radially, and was deposited on a cylindrical area of 100 cm2 and height ∼ 20 mm, which was co-axial with the electrode axis. The thickness distribution was axially symmetric within 10%. The steady-state mass deposition rate was 400 mg/min. The HRAVA system produced an almost MP-free radially expanded mass throughput and cathode utilization efficiency ∼ 40 times greater than with the FVAD system.