Use of the reverse pulse plating method to improve the properties of cobalt-molybdenum electrodeposits

Conditions leading to cobalt-molybdenum (Co-Mo) electrodeposits with high Mo percentages were studied. Deposits prepared by means of direct current electroplating showed a large amount of cracks. Maximum amount of Mo in the films was attained by applying deposition potentials in the − 1200 mV to − 1300 mV range. Reverse pulse plating mode has been proved useful for obtaining nanocrystalline, low stressed Co-Mo deposits with similar Mo percentages as in direct current conditions (35-40 wt.%). The coatings were exposed to a static microindentation test, which highlighted that the pulse plated samples were more compact and less fragile than the direct current plated ones.