Effects of substrate temperature on the surface of polymer thin films prepared by R.F. sputtering with a polyimide target

In this study, we characterized polymer thin films deposited by a conventional radio frequency sputtering apparatus introduced into argon and nitrogen gases with a polyimide target onto copper substrates.Heating effects due to heating the copper substrate at 250 °C in the sputtering on tribological and adhesion properties of thin films were investigated with measuring friction coefficient, wear durability and pull strength. Surface roughness of the nitrogen sputtered thin film decreased by the heating. Friction coefficient of argon and nitrogen sputtered thin films prepared at 250 °C was almost the same level as that prepared at room temperature, respectively. Wear durability of these thin films and adhesion strength between these thin films and copper substrate decreased by the heating.