Abnormal resistivity behavior of Cu–Ni and Cu–Co alloys in undercooled liquid state

The resistivity behavior of undercooled liquid Cu–Ni and Cu–Co alloys had been studied in the contactless method, to probe the structure transition in undercooled melts during the cooling process. Over the entire concentration range, linear behavior of resistivity with temperature was obtained in liquid and undercooled liquid Cu–Ni system. It implied that the formation of icosahedral order might not influence the electron scattering in undercooled liquid Cu–Ni alloys. Similar results were obtained in Cu–Co system in the vicinity of liquidus temperature. A turning point was obvious in temperature coefficient of resistivity for undercooled liquid Cu–Co alloys around the bimodal line, which was interpreted to be responsible for metastable liquid–liquid phase separation. During liquid phase separation process, resistivity decreased and the temperature coefficient of resistivity was larger than that of homogeneous melts. In combination with transmission electron microscopy and scanning electron microscope studies on the as-solidified microstructure, this was interpreted as the formation of egg-type structure and concentration change in Cu-rich and Co-rich phases. The mechanism controlling the separation and droplets motion was also discussed in undercooled liquid Cu–Co system.