Influence of particle surface properties on the dielectric behavior of silica/epoxy nanocomposites

Silica/epoxy composites have been widely used in functional electric device applications. Silica nanoparticles, both unmodified and modified with the coupling agent KH-550, were used to prepare epoxy composites. Dielectric measurements showed that nanocomposites exhibit a higher dielectric constant than the control sample, and had more obvious dielectric relaxation characteristics. Results showed that particle surface properties have a profound effect on the dielectric behavior of the nanocomposites. These characteristics are attributed to the local ununiformity of the microstructure caused by the large interface area and the interaction between the filler and the matrix. This phenomenon is explained in terms of prolonging chemical chains created during the curing process. The mechanism is discussed with measurements of X-ray diffraction (XRD) and Fourier transform infrared (FTIR).