کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
20248 43165 2015 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Development of two-step process for enhanced biorecovery of Cu–Zn–Ni from computer printed circuit boards
موضوعات مرتبط
مهندسی و علوم پایه مهندسی شیمی بیو مهندسی (مهندسی زیستی)
پیش نمایش صفحه اول مقاله
Development of two-step process for enhanced biorecovery of Cu–Zn–Ni from computer printed circuit boards
چکیده انگلیسی

Metal pollution due to the huge electronic waste (E-waste) accumulation is widespread across the globe. Extraction of copper, zinc and nickel from computer printed circuit boards (c-PCB) with a two-step bleaching process using ferric sulphate generated by Leptospirillum ferriphilum dominated consortium and the factors influencing the process were investigated in the present study. The studied factors with 10 g/L pulp density showed that pH 2.0 was optimum which resulted in 87.50–97.80% Cu–Zn–Ni extraction. Pre-treatment of PCB powder with acidified distilled water and NaCl solution showed 3.80–7.98% increase in metal extraction corresponding to 94.08% Cu, 99.80% Zn and 97.99% Ni extraction. Particle size of 75 μm for Cu and Zn while 1680 μm for Ni showed 2-folds increase in metal extraction, giving 97.35–99.80% Cu–Zn–Ni extraction in 2–6 days of reaction time. Whereas; 2.76–3.12 folds increase in Cu and Zn extraction was observed with the addition of 0.1% chelating agents. When the studies were carried out with high pulp density, ferric iron concentration of 16.57 g/L was found to be optimum for metal extraction from 75 g/L c-PCB and c-PCB addition in multiple installments resulted in 8.81–26.35% increase in metal extraction compared to single addition. The studied factors can be implemented for the scale-up aimed at faster recovery of multimetals from E-waste and thereby providing a secondary source of metal in an eco-friendly manner.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Bioscience and Bioengineering - Volume 120, Issue 2, August 2015, Pages 167–173
نویسندگان
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