Effect of multi-walled carbon nanotubes as second phase on the copper electrochemical reduction behavior for fabricating their nanostructured composite films

Nanostructured copper/multi-walled carbon nanotube (Cu/MWCNT) films have been fabricated by means of pulse electrodeposition in an acidic plating bath containing copper sulfate and purified MWCNTs. The influence of MWCNTs on copper electrochemical reduction behavior is studied by cathodic polarization and electrochemical impedance spectrums (EIS) analysis. Results show that the existence of the hydrochloric acid purified MWCNTs in the electrolytes shows the accelerating action toward Cu electrochemical reduction during the electrodeposition process, making the Cu films finely grow with the crystal growth toward the (1 1 1) orientation compared to the pure Cu electrodeposited film. The resulting Cu/MWCNT composite film is comprised of Cu matrix and the spatial network of MWCNTs with a considerable high MWCNT content.