High heat load properties of actively cooled W/CuCrZr mock-ups by diffusion bonding with Ni or Ti interlayer

Two actively cooled mock-ups with 5 mm thick tungsten armor, joined to CuCrZr alloy, were successfully developed by diffusion bonding technique with Ti or Ni interlayer for the EAST device in ASIPP. Its thermal response and thermal fatigue properties were investigated with active cooling. No cracks and voids occurred at the interface of W/CuCrZr after thermal response test with a heat flux from 0 MW/m2 to 10 MW/m2. It survived up to 200 cycles under 10 MW/m2. The temperature distributions of the mock-up were estimated by Finite Element Analysis. The simulation results indicated that thermal contact capability between the tungsten and the copper alloy with Ti interlayer was higher than that of Ni interlayer. Results showed that diffusion bonding of W/CuCrZr with Ni or Ti interlayer is a potential candidate for a high heat resistance armor material on plasma facing components (PFC).