کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
273549 505048 2007 10 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Examination of Be//Cu joints in hipped Be tiles by using Ion Beam Analysis methods
موضوعات مرتبط
مهندسی و علوم پایه مهندسی انرژی مهندسی انرژی و فناوری های برق
پیش نمایش صفحه اول مقاله
Examination of Be//Cu joints in hipped Be tiles by using Ion Beam Analysis methods
چکیده انگلیسی

Be has a tendency to form particularly brittle intermetallics with Cu and a lot of other elements. Insertion of interlayers may be a solution to increase bond quality. Ion Beam Analysis (IBA) methods have been considered together with scanning electron microscopy (SEM) and electron back-scattering diffraction (EBSD) as complementary techniques for the characterization of the Be//Cu junction. The following work aims at demonstrating how such techniques (used in micro-beam mode) coupled with SEM/EBSD data, can bring valuable information in this area. Interlayer-free mock-ups reveal intermetallics which are mainly BeCu (apparently mixed with lower quantities of BeCu2 compound). While Cr or Ti interlayers seem to behave as good Be diffusion barriers preventing the formation of BeCu, they strongly interact with Cu to form CuTi2 or Cr2Ti intermetallics. In the case of Cr, Be seems to be incorporated into the Cr layer.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Fusion Engineering and Design - Volume 82, Issues 15–24, October 2007, Pages 1671–1680
نویسندگان
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