کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
3371931 1219236 2012 7 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Application of copper to prevent and control infection. Where are we now?
موضوعات مرتبط
علوم زیستی و بیوفناوری ایمنی شناسی و میکروب شناسی میکروبیولوژی و بیوتکنولوژی کاربردی
پیش نمایش صفحه اول مقاله
Application of copper to prevent and control infection. Where are we now?
چکیده انگلیسی

SummaryBackgroundThe antimicrobial effect of copper has long been recognized and has a potential application in the healthcare setting as a mechanism to reduce environmental contamination and thus prevent healthcare-associated infection (HCAI).AimTo review the rationale for copper use, the mechanism of its antimicrobial effect, and the evidence for its efficacy.MethodsA PubMed search of the published literature was performed.FindingsExtensive laboratory investigations have been carried out to investigate the biocidal activity of copper incorporated into contact surfaces and when impregnated into textiles and liquids. A limited number of clinical trials have been performed, which, although promising, leave significant questions unanswered. In particular there is a lack of consensus on minimum percentage copper alloys required for effectiveness, the impact of organic soiling on the biocidal effect of copper, and the best approach to routine cleaning of such surfaces. Limited information is available on the ability of copper surfaces to eradicate spores of Clostridium difficile.ConclusionAdditional studies to demonstrate that installing copper surfaces reduces the incidence of HCAI are required and the cost-effectiveness of such intervention needs to be assessed. Further research in a number of key areas is required before the potential benefits of using copper routinely in the clinical setting to prevent and control infection can be confirmed and recommended.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Hospital Infection - Volume 81, Issue 4, August 2012, Pages 217–223
نویسندگان
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