Effects of silver and copper nanoparticles in particleboard to control Trametes versicolor fungus

• Both nanoparticles significantly prohibited the growth of Trametes versicolor hyphae.
• Both nanoparticles ameliorated the decrease in hardness due to fungi exposure.
• High significant correlation was found between mass loss and hardness values.
• Nanocopper is more appropriate to be used in particleboard as it also increased the hardness.

This study looked at commercial particleboard treatment with 200 ppm nanosilver (NS) and nanocopper (NC) suspensions (10–80 nm) to assess the effects on hardness and resistance to the white-rot fungus Trametes versicolor. Suspensions were added to mats at two levels (100 and 150 ml kg−1 dry weight wood particles) and comparison was made with control boards. Both metal nanoparticles had significantly improved resistance to T. versicolor, resulting in decreasing mass loss (ML). Nanocopper was more effective at lower levels. Fungal exposure was associated with reduced hardness in NS-control and NS100 treatments, whereas NS150 produced significant reduction in fungal growth. Copper more effectively protected panels from fungal attack. High significant correlation (85%) was found between ML and hardness values.