Characterization on acceleration-factor equation for packaging-solder joint reliability

- This study proposes a new AF equation to decouple the effects of the ramp rate and dwell time during an ATC test.
- Two new terms in the equation are related to ramp rate for the strain rate effect, and dwell time for the creep effect.
- The new AF equation produces a good correlation between the simulation and test results for different type packages.

The well-known Norris-Landzberg acceleration factor (N-L AF) empirical equation was developed based on the accelerated thermal cycling (ATC) test. It has been widely used for many years to predict product lifetimes. However, some recent test results have shown the insufficiency of this equation when the ramp rates change. The AF equation predicts a longer lifetime when the ramp rate is higher, which contradicts the experimental test data. The reason for this discrepancy is that the N-L AF equation combines both ramp rate and dwell time factors in one frequency term. Thus, modifying the current AF equation to more precisely predict product lifetimes has become an important topic.This study proposes a new AF equation to decouple the effects of the ramp rate and dwell time during an ATC test, replacing the frequency term used in the N-L equation with two new terms. One is related to the ramp rate for the strain rate effect, and the other is related to the dwell time for the creep effect of the packaging solder joint material. The new AF equation produces a good correlation between the simulation and test results for different package types discussed in the literature with various ramp rates and dwell times.