Hydroxyl terminated poly(ether ether ketone) with pendent methyl group toughened epoxy resin: miscibility, morphology and mechanical properties

The synthesis, processing, thermal and mechanical properties and fracture toughness of epoxy resin formulated with hydroxyl terminated poly(ether ether ketone) with pendent methyl group are reported. Hydroxyl terminated poly(ether ether ketone) oligomers based on methyl hydroquinone (PEEKMOH) were synthesised from methylhydroquinone and 4,4′-difluorobenzophenone in N-methyl-2-pyrrolidone. PEEKMOH oligomers with different molecular weights were synthesised and characterised. Blends of diglycidyl ether of bisphenol-A epoxy resin with PEEKMOH were prepared by melt mixing. The uncured blends were homogeneous and the Tg-composition behaviour was predicted using Fox, Gordon-Taylor and Kelley-Bueche equations. Reaction induced phase separation occurred in the blends on curing with 4,4′-diaminodiphenyl sulfone. Scanning electron microscopy studies revealed the two-phase morphology of the blends. Domain size of the blends increased with increase in PEEKMOH8 in the blends. Phase separation in the blends occurred by nucleation and growth mechanism. Infrared spectroscopic studies revealed that some of the epoxy groups were opened up by hydroxyl group of PEEKMOH. The tensile and flexural properties of the blends were comparable to that of neat epoxy resin and the properties were dependent on the composition of the blend and molecular weight of PEEKMOH used. Dynamic mechanical analysis revealed two glass transition temperatures corresponding to epoxy rich and thermoplastic rich phases. The crosslink density of epoxy resin decreased with the addition of PEEKMOH to epoxy resin. The blends exhibited superior fracture toughness compared to unmodified epoxy resin. The increase in fracture toughness was due to local plastic deformation of the matrix, crack path deflection and crack pinning. The thermal stability of amine cured epoxy resin was not affected by the incorporation of PEEKMOH into the epoxy resin.