کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5190765 | 1381216 | 2005 | 6 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Synthesis and cryogenic properties of polyimide-silica hybrid films by sol-gel process
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
شیمی
شیمی آلی
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
Polyimide-silica hybrid films were prepared from tetraethoxysilane (TEOS) and polyamic acid (PAA) via sol-gel process in the solution of N,N-dimethylacetamide (DMAc). The cryogenic mechanical and electrical properties of polyimide-silica hybrid films were studied taking into account the effects of silica content. The results indicated that the cryogenic modulus increased with the increase of silica content while the tensile strength and failure strain had a maximum value at proper silica contents. Moreover, the tensile strength and modulus of the hybrid films at cryogenic temperature (77Â K) were obviously higher than those at room temperature, while the failure strain of the hybrid films was much lower at cryogenic temperature (77Â K) than that at room temperature. The mean electrical breakdown strength of the hybrid films was shown to range from 151 to 225Â kV/mm at cryogenic temperature (77Â K).
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Polymer - Volume 46, Issue 19, 8 September 2005, Pages 8373-8378
Journal: Polymer - Volume 46, Issue 19, 8 September 2005, Pages 8373-8378
نویسندگان
Yi-He Zhang, Yan Li, Shao-Yun Fu, John H. Xin, Walid A. Daoud, Lai-Feng Li,