کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5191192 | 1381228 | 2005 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
High thermal stable thermoplastic-thermosetting polyimide film by use of asymmetric dianhydride (a-BPDA)
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موضوعات مرتبط
مهندسی و علوم پایه
شیمی
شیمی آلی
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
In order to obtain thermoplastic (before curing) and thermosetting (after curing) polyimides with high Tg for adhesive film, we prepared novel polyimides having phenylethynyl group in the side chain (44% of concentration of curing group) from asymmetric 2,3,3â²,4â²-biphenyltetracarboxylic dianhydride (a-BPDA), 3,4â²-oxydianiline (3,4â²-ODA) or 1,3-bis(4-aminophenoxy)benzene (1,3,4-APB) or 1,3-bis(3-aminophenoxy)benzene (1,3,3-APB), and 2,4-diamino-1-(4-phenylethynylphenoxy)benzene (mPDAp). Among three kinds of polymer, uncured polyimide of a-BPDA/1,3,4-APB; mPDAp had rather high Tg (265 °C, DMA) and thermoplasticity (Eâ² drop>103 at Tg). After curing reaction of phenylethynyl group, the Tg of the polyimide was increased dramatically (364 °C, DMA). The polyimide derived from 1,3,4-APB having less concentration of curing group (20%) was also prepared to improve further film flexibility and toughness.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Polymer - Volume 46, Issue 18, 23 August 2005, Pages 6968-6975
Journal: Polymer - Volume 46, Issue 18, 23 August 2005, Pages 6968-6975
نویسندگان
Takeshi Sasaki, Hiroyuki Moriuchi, Shoichiro Yano, Rikio Yokota,