Enhanced adhesion of polypropylene to copper substrates

Varying concentrations of maleic anhydride (MAH) were grafted onto three types of polypropylene (PP) in the presence of dicumyl peroxide (DCP). Pull-off adhesive strength from a copper substrate, tensile Young's modulus, and tensile strain-at-break were determined and SEM observations made as a function of the MAH concentration for each PP. One of the PPs plus 3 wt% MAH provides a high value of the adhesive strength along with the Young modulus and the strain-at-break sufficient for the use as a coating for copper wires and cables.