Experimental investigation of the effect of temperature on the strength of polyimide contact structures

A new photogrammetry based measurement technique for contact areas in line contact structures is developed. From the data collected by this technique, a method for measuring the contact strength of contact structures in high temperature applications is proposed. The contact strength of a line contact structure of polyimide at different temperatures is measured; the results show that the increase in temperature decreases the contact strength of the structure. The effect of temperature on the contact strength is studied by investigating the occurrence and evolution of yielding core within the structure at different temperatures. The decrease in the yield strength and elastic modulus of the polyimide material at high temperature induces core yielding at lower loads and eases the propagation of core yielding to the surface.